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Thermal, Mechanical, and Dimensional Characterization of Substrates for Electronics

Wednesday, August 26, 2026
11:00 AM EDT | 4:00 PM BST | 5:00 pm CEST


Accurate characterization of advanced substrate materials is essential for the development of next-generation electronics. In this webinar, materials metrology techniques for electronics substrates will be discussed. Case studies will be used to relate the techniques to problems across a range of materials and how these methods can provide critical insights into material performance.

What You Will Learn:


  • Material degradation
  • Thermoset curing
  • Quantification of thermal expansion and hygroscopic expansion
  • Understanding material transitions in polymer films

Who Should Attend?


This seminar is open to professionals involved in electronics and electronic materials research, development, and manufacturing. Whether you are just beginning to explore analytical tools or are a seasoned expert, you will leave with valuable insights.


Meet the Speakers



Speaker 01 Image

Francis Klincewicz

Field Applications Scientist
Waters Materials Sciences Division (Formerly TA Instruments)

Francis Klincewicz is a Field Applications Scientist with a specialization in thermal characterization. His primary interest is the characterization of multi-component systems, especially composite and blended materials. He graduated from the University of Delaware with a PhD in Materials Science and Engineering, where he studied advanced 3D-printed bilayer materials.

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* Some modules and OEM products are excluded. Trade in required to receive discount. Please contact your local TA representative for more details. Deals valid for systems purchased and delivered before September 18, 2020.