From Formulation to Flight: Material Characterization for High-Performance Applications

Wednesday, October 14, 2026
9:00 am - 3:00 pm EDT


Location

University of Dayton Research Institute
1700 S. Patterson Blvd. Dayton, OH 45479
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Advanced materials such as composites, coatings, and UV-curable systems are driving innovation in aerospace and defense, but their success depends on a deep understanding of performance, processing, and cure behavior. This presentation highlights how DMA and rheological characterization provide actionable insights that accelerate material development, optimize manufacturing, and ensure reliability in demanding applications.

This presentation highlights how advanced thermal and rheological techniques can be used to diagnose and resolve processing challenges in aerospace composites and film adhesives. Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and rheology/dynamic mechanical analysis (DMA) will be applied to real-world case studies to identify cure behavior, thermal stability, and flow characteristics that drive manufacturability and performance. Attendees will gain practical insights into selecting and interpreting these methods to improve process robustness and material quality.

An overview of thermal analysis instrumentation, when to use it, and why it will help your research.

Abstracts


Meet the Speakers



Speaker 01 Image

Mengying (Sara) Yang, Ph.D.

Rheology Applications Scientist
Waters Materials Sciences Division (Formerly TA Instruments)

Mengying (Sara) Yang is a Rheology Applications Scientist at Waters Materials Sciences. She holds a bachelor's degree in environmental science from Northwestern Polytechnical University, where her research focused on wastewater treatment, graphene foams for electromagnetic wave absorption, and electrode materials for supercapacitors. She earned her Ph.D. in Materials Science and Engineering from the University of Delaware, specializing in structure–property relationships of solid polymer electrolytes for lithium‑ion batteries. Dr. Yang has contributed to the field through patents, publications, and conference presentations. In her role at Waters Materials Sciences, she applies deep scientific expertise to troubleshoot advanced rheological challenges and provide data‑driven guidance that elevates customer outcomes.

Speaker 02 Image

David Darr

Senior Technical Sales Representative
Waters Materials Sciences Division (Formerly TA Instruments)

David Darr is a Senior Technical Field Sales Representative with TA Instruments, where he specializes in thermal analysis and materials characterization instrumentation for academic and industrial research laboratories throughout Ohio. With a B.S. in Chemistry from Bowling Green State University and over 10 years experience in analytical instrumentation, materials testing, and laboratory research, David brings a technical perspective to the application of DSC, TGA, DMA, TMA, and related techniques for understanding the thermal, mechanical, and physical properties of advanced materials, including polymers, composites, and aerospace materials.

Speaker 03 Image

Amber Hancock

Principal Engineer Materials & Process
Northrop Grumman


Speaker 03 Image

Johnathan O'Donnell

Materials Engineer
University of Dayton Research Institute

Johnathan O’Donnell is a Materials Engineer at University of Dayton Research Institute with 14 years of experience in materials research and development. His work includes thermal analysis, development, and fabrication of novel polymer and ceramic materials, with a focus on ultra-high temperature composite materials for structural and protective application. He improves material properties through microstructural and chemical characterization, process development, novel additives, and novel polymers.


Join us for a free technical seminar designed for scientists, engineers, and researchers working on developing novel high-performance materials. Hear from industry experts on how they use advanced characterization techniques such as thermal analysis, rheology, and mechanical analysis to evaluate performance, optimize formulations, and support compliance with industry standards across aerospace, advanced materials, and other markets that demand exacting performance.

In addition to our panel of industry speakers, there will be a lab tour to see the instruments behind the science. Whether you are developing new formulations, troubleshooting processing challenges, or seeking to improve product reliability, you'll leave this event with knowledge you can apply immediately. Attendance is free, but seating is limited. Register today to secure your spot! A continental breakfast and lunch will be provided.

Special thanks to the University of Dayton Research Institute (UDRI) for hosting this event.

As part of site security requirements, all visitors must complete a pre-visit screening. After registering, you will be contacted to provide the necessary information, which includes citizenship details and passport information (if applicable).


Agenda

9:00 - 9:30 AM

Check in and breakfast

9:30 - 9:40 AM

Introductions - UDRI and Waters Materials Sciences

9:40 - 10:20 AM

Essential Thermal Techniques for Advanced Materials Characterization

10:20 - 10:50 AM

Enabling Aerospace Material Reliability Through DMA and Rheological Analysis

10:50 - 11:00 AM

Break

11:00 - 11:30 AM

DSC: Development of Heat Capacity Measurements for Aerospace Applications

11:30 - 12:00 PM

From Data to Decisions: Applying DSC, TGA, and DMA/Rheology to Aerospace Composite and Film Adhesive Processing

12:00 - 1:00 PM

Lunch

1:00 - 2:30 PM

Lab Tours

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*NOTE: Please enter your name exactly as it appears on your driver's license, passport, or state-issued ID. This will be used for building security verification.

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* Some modules and OEM products are excluded. Trade in required to receive discount. Please contact your local TA representative for more details. Deals valid for systems purchased and delivered before September 18, 2020.